The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2025
Filed:
May. 10, 2023
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Sheng-Chieh Yang, Hsinchu, TW;
Ching-Hua Hsieh, Hsinchu, TW;
Chih-Wei Lin, Hsinchu County, TW;
Yu-Hao Chen, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 25/16 (2023.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 23/49822 (2013.01);
Abstract
A semiconductor package includes a first integrated circuit and a first waveguide. The first integrated circuit includes an optical coupler. The first waveguide is optically coupled to the optical coupler. In some embodiments, the first waveguide protrudes beyond the optical coupler. In some embodiments, the first waveguide is partially overlapped with the optical coupler.