The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2025
Filed:
May. 31, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Minjung Kim, Cheonan-si, KR;
Dongkyu Kim, Anyang-si, KR;
Jongyoun Kim, Seoul, KR;
Seokhyun Lee, Hwaseong-si, KR;
Jaegwon Jang, Hwaseong-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a substrate; and a first semiconductor device and a second semiconductor device that are provided on the substrate. The substrate includes a first dielectric layer and a second dielectric layer provided on the first dielectric layer, a plurality of signal lines provided between the first dielectric layer and the second dielectric layer and connecting the first semiconductor device to the second semiconductor device, and a conductive pad and a conductive plate provided on the second dielectric layer. The conductive pad overlaps the first semiconductor device or the second semiconductor device. The conductive plate overlaps the signal lines.