The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2025

Filed:

Sep. 26, 2023
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Shih-Wei Peng, Hsinchu, TW;

Chia-Tien Wu, Taichung, TW;

Jiann-Tyng Tzeng, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5384 (2013.01); H01L 21/76802 (2013.01); H01L 21/76879 (2013.01); H01L 23/5386 (2013.01);
Abstract

An integrated circuit includes a first conductive structure including a root portion of the first conductive structure, tine portions that are arranged in a first semiconductor layer, a neck portion surrounded by a film structure. The integrated circuit further includes a second conductive structure having first and second portions that are stacked along a first direction. The first portion of the second conductive structure is surrounded by the film structure and the second portion of the second conductive structure is in the first semiconductor layer. A third conductive structure in the integrated circuit has horizontal and vertical structures. The horizontal structure extends in a second semiconductor layer and the vertical structure passes through the second semiconductor layer and the film structure to contact a first conductive rail. The first conductive rail and the tine portions are apart from the horizontal structure along the first direction by a same distance.


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