The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2025

Filed:

Oct. 06, 2022
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Abhishek Dube, Fremont, CA (US);

Xuebin Li, Sunnyvale, CA (US);

Hua Chung, San Jose, CA (US);

Flora Fong-Song Chang, Saratoga, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 25/18 (2006.01); C23C 16/02 (2006.01); C23C 16/24 (2006.01); C23C 16/54 (2006.01); C23C 16/56 (2006.01); C30B 29/06 (2006.01); C30B 33/12 (2006.01); H01J 37/32 (2006.01); H01L 21/02 (2006.01); H01L 21/3065 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
C30B 25/186 (2013.01); C23C 16/0218 (2013.01); C23C 16/0236 (2013.01); C23C 16/0245 (2013.01); C23C 16/24 (2013.01); C23C 16/54 (2013.01); C23C 16/56 (2013.01); C30B 29/06 (2013.01); C30B 33/12 (2013.01); H01J 37/32091 (2013.01); H01J 37/321 (2013.01); H01J 37/32357 (2013.01); H01J 37/32862 (2013.01); H01J 37/32899 (2013.01); H01L 21/02532 (2013.01); H01L 21/0257 (2013.01); H01L 21/02576 (2013.01); H01L 21/0262 (2013.01); H01L 21/02661 (2013.01); H01L 21/3065 (2013.01); H01L 21/67115 (2013.01); H01L 21/6719 (2013.01); H01L 21/67207 (2013.01); H01L 21/68742 (2013.01);
Abstract

Embodiments of the present disclosure generally relate to methods for forming epitaxial layers on a semiconductor device. In one or more embodiments, methods include removing oxides from a substrate surface during a cleaning process, flowing a processing reagent containing a silicon source and exposing the substrate to the processing reagent during an epitaxy process, and stopping the flow of the processing reagent. The method also includes flowing a purging gas and pumping residues from the processing system, stopping the flow of the purge gas, flowing an etching gas and exposing the substrate to the etching gas. The etching gas contains hydrogen chloride and at least one germanium and/or chlorine compound. The method further includes stopping the flow of the at least one compound while continuing the flow of the hydrogen chloride and exposing the substrate to the hydrogen chloride and stopping the flow of the hydrogen chloride.


Find Patent Forward Citations

Loading…