The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2025

Filed:

Oct. 04, 2019
Applicant:

Versum Materials Us, Llc, Tempe, AZ (US);

Inventors:

Meiliang Wang, Shanghai, CN;

Xinjian Lei, Vista, CA (US);

Assignee:

Versum Materials US, LLC, Tempe, AZ (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C01B 33/12 (2006.01); C07F 7/08 (2006.01); C23C 16/40 (2006.01); C23C 16/44 (2006.01); C23C 16/455 (2006.01);
U.S. Cl.
CPC ...
C01B 33/126 (2013.01); C07F 7/0896 (2013.01); C23C 16/401 (2013.01); C23C 16/4408 (2013.01); C23C 16/45553 (2013.01); C01P 2002/85 (2013.01); C01P 2006/10 (2013.01); C01P 2006/80 (2013.01);
Abstract

A method and composition for depositing a silicon oxide film in an atomic layer deposition process at one or more temperatures of 600° C. or greater are provided. In one aspect, there is provided a method to deposit a silicon oxide film or material on a substrate in a reactor at one or more temperatures ranging from about 600° C. to 1000° C.; comprising the steps of: introducing into the reactor at least one halidocarbosilane precursor selected from the group of compounds having Formulae I and II described herein; purging the reactor with a purge gas; introducing an oxygen-containing source into the reactor; and purging the reactor with a purge gas; and wherein the steps are repeated until a desired thickness of silicon oxide is deposited.


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