The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2025
Filed:
Oct. 14, 2022
Applicant:
At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;
Inventor:
Jiangfeng Zhou, Wuxi, CN;
Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/42 (2005.12); H01L 21/48 (2005.12); H01L 23/498 (2005.12); H05K 1/03 (2005.12); H05K 1/11 (2005.12); H05K 3/06 (2005.12); H05K 3/10 (2005.12); H05K 3/00 (2005.12);
U.S. Cl.
CPC ...
H05K 3/429 (2012.12); H01L 21/4857 (2012.12); H01L 21/486 (2012.12); H01L 23/49822 (2012.12); H01L 23/49894 (2012.12); H05K 1/034 (2012.12); H05K 1/0346 (2012.12); H05K 1/036 (2012.12); H05K 1/115 (2012.12); H05K 3/064 (2012.12); H05K 3/108 (2012.12); H05K 3/427 (2012.12); H05K 1/0306 (2012.12); H05K 3/0047 (2012.12); H05K 2201/015 (2012.12); H05K 2201/0154 (2012.12); H05K 2201/09509 (2012.12); H05K 2203/072 (2012.12); H05K 2203/0723 (2012.12);
Abstract
A component carrier includes a stack with at least one electrically conductive layer structure, at least one electrically insulating layer structure, and a hole in the stack having a first hole portion covered with metal and having a second hole portion not covered with metal, wherein the second hole portion is defined by an anti-plating dielectric structure and an electroless plateable separation barrier.