The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 06, 2025

Filed:

Apr. 29, 2022
Applicants:

Stmicroelectronics (Crolles 2) Sas, Crolles, FR;

Stmicroelectronics International N.v., Geneva, CH;

Inventors:

Stephane Monfray, Eybens, FR;

Siddhartha Dhar, Grenoble, FR;

Alain Fleury, Barberaz, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2005.12); H01L 21/48 (2005.12); H01L 23/373 (2005.12); H01L 23/42 (2005.12); G11C 13/00 (2005.12); H10N 70/00 (2022.12);
U.S. Cl.
CPC ...
H01L 23/66 (2012.12); H01L 21/4882 (2012.12); H01L 23/3736 (2012.12); H01L 23/42 (2012.12); G11C 13/0004 (2012.12); H01L 2223/6677 (2012.12); H10N 70/8413 (2023.01);
Abstract

The present disclosure relates to an electronic circuit comprising a semiconductor substrate, radiofrequency switches corresponding to MOS transistors comprising doped semiconductor regions in the substrate, at least two metallization levels covering the substrate, each metallization level comprising a stack of insulating layers, conductive pillars topped by metallic tracks, at least two connection elements each connecting one of the doped semiconductor regions and formed by conductive pillars and conductive tracks of each metallization level. The electronic circuit further comprises, between the two connection elements, a trench crossing completely the stack of insulating layers of one metallization level and further crossing partially the stack of insulating layers of the metallization level the closest to the substrate, and a heat dissipation device adapted for dissipating heat out of the trench.


Find Patent Forward Citations

Monfray, Stephane. (2025). Electronic circuit comprising a rf switches having reduced parasitic capacitances (U.S. Patent No. 12293981). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12293981

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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