The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2025
Filed:
Jan. 14, 2025
Senju Metal Industry Co., Ltd., Tokyo, JP;
Shinji Kikuchi, Tokyo, JP;
Yoshie Tachibana, Tokyo, JP;
Tomoki Sasaki, Tokyo, JP;
Ayumi Mio, Tokyo, JP;
SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;
Abstract
A solder paste containing a first metal powder, a second metal powder, and a flux is employed. The first metal powder contains Sn. A second metal powderA has a core portionformed of an alloy containing Ni and Fe, and a surface layerthat covers the core portionand is formed of a metal containing Ni. An Ni content in the metal forming the surface layerof the second metal powderA is 50% by mass or more relative to a total mass of the metal forming the surface layerof the second metal powderA. The surface layerof the second metal powderA has a thickness of 0.05 μm or more and 0.30 μm or less.