The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2025

Filed:

Feb. 23, 2023
Applicant:

Ibiden Co., Ltd., Gifu, JP;

Inventors:

Jun Sakai, Ogaki, JP;

Takuya Inishi, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Gifu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2005.12); H05K 1/11 (2005.12); H05K 3/00 (2005.12); H05K 3/46 (2005.12);
U.S. Cl.
CPC ...
H05K 1/0298 (2012.12); H05K 1/115 (2012.12); H05K 3/0094 (2012.12); H05K 3/4644 (2012.12); H05K 2201/0212 (2012.12); H05K 2203/13 (2012.12);
Abstract

A printed wiring board includes a first conductor layer, an insulating layer formed on the first conductor layer, a second conductor layer formed on the insulating layer, and a via conductor formed in the insulating layer such that the via conductor is connecting the first and second conductor layers. The insulating layer has opening exposing portion of the first conductor layer such that the via conductor is formed in the opening, the second conductor layer and via conductor are formed such that the second conductor layer and via conductor include a seed layer and an electrolytic plating layer on the seed layer, and the insulating layer includes resin and inorganic particles dispersed in the resin such that the particles include first particles forming inner wall surface in the opening and second particles embedded in the insulating layer and the first particles have shapes different from shapes of the second particles.


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