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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12288738 B1

PDFFull Text
Date of Patent:
Apr. 29, 2025

Filed:

Apr. 12, 2021

Semiconductor device package and method of fabricating the same

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Younghwan Park, Seongnam-si, KR;

Jongseob Kim, Seoul, KR;

Jaejoon Oh, Seongnam-si, KR;

Soogine Chong, Seoul, KR;

Sunkyu Hwang, Seoul, KR;

Assignee:

Samsung Electronics Co., Ltd., Gyeonggi-do, KR;

Attorney:

HARNESS, DICKEY & PIERCE, P.L.C.

Primary Examiner:

Younes Boulghassoul

Assistant Examiner:

Quinton A Brasfield

Int. Cl.
CPC ...
H01L 23/495 (2005.12); H01L 21/56 (2005.12); H01L 23/00 (2005.12); H01L 23/31 (2005.12); H01L 23/367 (2005.12); H01L 29/20 (2005.12);
U.S. Cl.
CPC ...
H01L 23/49562 (2012.12); H01L 21/561 (2012.12); H01L 21/568 (2012.12); H01L 23/3107 (2012.12); H01L 23/367 (2012.12); H01L 24/16 (2012.12); H01L 24/94 (2012.12); H01L 29/2003 (2012.12); H01L 2224/16245 (2012.12);
Abstract

Provided are a semiconductor device package and/or a method of fabricating the semiconductor device package. The semiconductor device package may include a semiconductor device including a plurality of electrode pads on an upper surface of the semiconductor device, a lead frame including a plurality of conductive members bonded to the plurality of electrode pads, and a mold between the plurality of conductive members.

Find Patent Forward Citations

Park, Younghwan. (2025). Semiconductor device package and method of fabricating the same (U.S. Patent No. 12288738). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12288738

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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