The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2025
Filed:
Apr. 12, 2021
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Younghwan Park, Seongnam-si, KR;
Jongseob Kim, Seoul, KR;
Jaejoon Oh, Seongnam-si, KR;
Soogine Chong, Seoul, KR;
Sunkyu Hwang, Seoul, KR;
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2005.12); H01L 21/56 (2005.12); H01L 23/00 (2005.12); H01L 23/31 (2005.12); H01L 23/367 (2005.12); H01L 29/20 (2005.12);
U.S. Cl.
CPC ...
H01L 23/49562 (2012.12); H01L 21/561 (2012.12); H01L 21/568 (2012.12); H01L 23/3107 (2012.12); H01L 23/367 (2012.12); H01L 24/16 (2012.12); H01L 24/94 (2012.12); H01L 29/2003 (2012.12); H01L 2224/16245 (2012.12);
Abstract
Provided are a semiconductor device package and/or a method of fabricating the semiconductor device package. The semiconductor device package may include a semiconductor device including a plurality of electrode pads on an upper surface of the semiconductor device, a lead frame including a plurality of conductive members bonded to the plurality of electrode pads, and a mold between the plurality of conductive members.