The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2025

Filed:

Jun. 14, 2022
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Hiroaki Niimi, Albany, NY (US);

Kandabara N Tapily, Albany, NY (US);

Takahiro Hakamata, Albany, NY (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 30/62 (2024.12); H01L 21/285 (2005.12); H01L 21/762 (2005.12); H01L 21/768 (2005.12); H10D 30/01 (2024.12); H10D 84/01 (2024.12); H10D 84/03 (2024.12); H10D 84/85 (2024.12);
U.S. Cl.
CPC ...
H10D 30/6219 (2024.12); H10D 30/62 (2024.12); H10D 84/853 (2024.12); H01L 21/28518 (2012.12); H01L 21/2855 (2012.12); H01L 21/28568 (2012.12); H01L 21/76224 (2012.12); H01L 21/76865 (2012.12); H01L 21/76897 (2012.12); H10D 30/024 (2024.12); H10D 84/0193 (2024.12); H10D 84/038 (2024.12);
Abstract

A semiconductor device includes a first raised feature in a NFET region on a substrate, a first n-type doped epitaxial semiconductor material grown on the first raised feature, the first n-type doped epitaxial material having a first upward facing surface and a first downward facing surface, a first contact metal on the first downward facing surface, and a second contact metal on the first upward facing surface. The device further includes a second raised feature in a PFET region on the substrate, a second p-type doped epitaxial semiconductor material grown on the second raised feature, the second p-type doped epitaxial material having a second upward facing surface and a second downward facing surface, a third contact metal on the second downward facing surface, and a fourth contact metal on the second upward facing surface, wherein the fourth contact metal is different from the second contact metal.


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