Cooling systems, cooling structures and electronic devices and methods for manufacturing or operating cooling systems, cooling structures and electronic devices

Ritu Bawa, Bangalore, IN;

Ruander Cardenas, Portland, OR (US);

Kathiravan D, Bangalore, IN;

Jia Yan Go, Kulim, MY;

Chin Kung Goh, Pulau Pinang, MY;

Jeff Ku, Taipei, TW;

Prakash Kurma Raju, Bangalore, IN;

Baomin Liu, Hillsborough, OR (US);

Twan Sing Loo, Penang, MY;

Mikko Makinen, Santa Clara, CA (US);

Columbia Mishra, Mountain View, CA (US);

Juha Paavola, Hillsboro, OR (US);

Prasanna Pichumani, Bangalore, IN;

Daniel Ragland, Sherwood, OR (US);

Kannan Raja, Beaverton, OR (US);

Khal Ern See, Batu Gajah, MY;

Javed Shaikh, Bangalore, IN;

Gokul Subramaniam, Bangalore, IN;

George Baoci Sun, Folsom, CA (US);

Xiyong Tian, Beijing, CN;

Hua Yang, Beijing, CN;

Mark Carbone, Cupertino, AL (US);

Vivek Paranjape, Hillsboro, OR (US);

Nehakausar Pinjari, Bangalore, IN;

Hari Shanker Thakur, Bangalore, IN;

Christopher Moore, Hillsboro, OR (US);

Gustavo Fricke, San Jose, CA (US);

Justin Huttula, Portland, OR (US);

Gavin Sung, Taipei, TW;

Sammi Wy Liu, Taipei, TW;

Arnab Sen, Bangalore, IN;

Chun-Ting Liu, Taipei, TW;

Jason Y. Jiang, Taipei, TW;

Gerry Juan, Taipei, TW;

Shih Wei Nien, Taipei, TW;

Lance Lin, Taipei, TW;

Evan Kuklinski, North Plains, OR (US);

Intel Corporation, Santa Clara, CA (US);