The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2025
Filed:
Aug. 20, 2023
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Suresh Reddy Yarragunta, Bangalore, IN;
Deepu Narasimiah Subhash, Bangalore, IN;
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2005.12); G06F 1/20 (2005.12);
U.S. Cl.
CPC ...
H05K 7/20409 (2012.12); G06F 1/20 (2012.12); H05K 7/20009 (2012.12); H05K 7/20436 (2012.12); H05K 7/20509 (2012.12);
Abstract
An apparatus including a heat sink having two or more sections of parallel fins that define colinear channels is disclosed herein. The colinear channels are configured to direct flow of air or coolant across the heat sink and have wider channel widths closer to an inlet for the air or coolant and narrower widths closer to an outlet for the air or coolant.
Yarragunta, Suresh. (2025). Apparatus including thermal management mechanism and methods of manufacturing the same (U.S. Patent No. 12284788). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12284788
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile