The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2025

Filed:

Nov. 03, 2020
Applicant:

Wolfspeed, Inc., Durham, NC (US);

Inventors:

In Hwan Ji, Durham, NC (US);

Jae-Hyung Park, Apex, NC (US);

Philipp Steinmann, Durham, NC (US);

Assignee:

Wolfspeed, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2005.12); H01L 23/00 (2005.12);
U.S. Cl.
CPC ...
H01L 23/3142 (2012.12); H01L 23/562 (2012.12);
Abstract

A power semiconductor device includes a semiconductor layer structure and a protective overcoating on a bonding surface of the semiconductor layer structure. The bonding surface includes a plurality of adhesion features along an interface with the protective overcoating. The adhesion features protrude from and/or are recessed in the bonding surface, and define an adhesion strength between the bonding surface and the protective overcoating that spatially varies along the interface. Related devices and fabrication methods are also discussed.


Find Patent Forward Citations

Ji, In. (2025). Power semiconductor devices with improved overcoat adhesion and/or protection (U.S. Patent No. 12283534). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12283534

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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