The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2025

Filed:

Jul. 18, 2021
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Upendra V. Ummethala, Cupertino, CA (US);

Blake Erickson, Gilroy, CA (US);

Prashanth Kumar, Union City, CA (US);

Michael Kutney, Santa Clara, CA (US);

Steven Trey Tindel, Austin, TX (US);

Zhaozhao Zhu, Milpitas, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 27/07 (2005.12); G01B 11/00 (2005.12); G01N 21/95 (2005.12); H01L 21/66 (2005.12); H01L 21/67 (2005.12); G01N 21/27 (2005.12);
U.S. Cl.
CPC ...
H01L 21/67276 (2012.12); G01B 11/002 (2012.12); G01N 21/9505 (2012.12); H01L 21/67259 (2012.12); H01L 21/67294 (2012.12); G01N 21/27 (2012.12);
Abstract

A method for a substrate measurement subsystem is provided. An indication is received that a substrate being processed at a manufacturing system has been loaded into a substrate measurement subsystem. First positional data of the substrate within the substrate measurement subsystem is determined. One or more portions of the substrate to be measured by one or more sensing components of the substrate measurement subsystem are determined based on the first positional data of the substrate and a process recipe for the substrate. Measurements of each of the determined portions of the substrate are obtained by one or more sensing components of the substrate measurement subsystem. The obtained measurements of each of the determined portions of the substrate are transmitted to a system controller.


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