The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2025

Filed:

Dec. 22, 2021
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Mikio Nakashima, Kumamoto, JP;

Shota Umezaki, Kumamoto, JP;

Hiroaki Inadomi, Kumamoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2005.12); B08B 3/02 (2005.12); B08B 3/08 (2005.12); F26B 5/00 (2005.12); H01L 21/02 (2005.12);
U.S. Cl.
CPC ...
H01L 21/67034 (2012.12); F26B 5/005 (2012.12); H01L 21/02101 (2012.12); B08B 3/022 (2012.12); B08B 3/08 (2012.12);
Abstract

A substrate processing apparatus includes a processing vessel; and a processing fluid supply configured to supply a processing fluid in a supercritical state into the processing vessel. The processing fluid supply includes a fluid supply line; a cooling device provided in the fluid supply line, and configured to cool the processing fluid in a gas state to produce the processing fluid in a liquid state; a pump positioned downstream of the cooling device; a heating device positioned downstream of the pump, and configured to heat the processing fluid in the liquid state to generate the processing fluid in the supercritical state; a first flow rate adjuster positioned between the pump and the heating device, and configured to adjust a supply flow rate of the processing fluid supplied to the processing vessel; and a controller configured to control the first flow rate adjuster.


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