The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2025
Filed:
May. 22, 2022
Applicant:
Umicore Suzhou Semiconductor Materials Co., Ltd., Suzhou, CN;
Inventors:
Assignee:
UMICORE SUZHOU SEMICONDUCTOR MATERIALS CO., LTD., Jiangsu, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/38 (2005.12); C25D 5/00 (2005.12); C25D 5/08 (2005.12); C25D 5/48 (2005.12); C25D 5/50 (2005.12); C25D 21/10 (2005.12);
U.S. Cl.
CPC ...
C25D 3/38 (2012.12); C25D 5/48 (2012.12); C25D 5/50 (2012.12); C25D 5/605 (2020.07); C25D 5/615 (2020.07); C25D 21/10 (2012.12);
Abstract
A method of electroplating nanograined copper on a substrate includes: providing the substrate; providing an electroplating bath that includes a copper salt, an acid, a leveler, a chlorine compound, an accelerator, a suppressor; and water; and electroplating the substrate in the electroplating bath to form the nanograined copper at room temperature. The suppressor is a ployether polyol compound, the nanograined copper has an average grain size of about 100 nm, and the nanograined copper has a resistivity of about 1.78-1.90 μOhm·cm. A nanograined copper prepared according to the method is also disclosed.