The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2025
Filed:
Aug. 29, 2021
Applicant:
Sumitomo Osaka Cement Co., Ltd., Tokyo, JP;
Inventors:
Keisuke Maeda, Tokyo, JP;
Yuuki Kinpara, Tokyo, JP;
Assignee:
SUMITOMO OSAKA CEMENT CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/12 (2005.12); B32B 7/12 (2005.12); B32B 9/04 (2005.12); H01L 21/683 (2005.12);
U.S. Cl.
CPC ...
B32B 37/12 (2012.12); B32B 7/12 (2012.12); B32B 9/041 (2012.12); B32B 2255/26 (2012.12); B32B 2307/304 (2012.12); B32B 2307/54 (2012.12); B32B 2309/02 (2012.12); B32B 2311/00 (2012.12); B32B 2315/02 (2012.12); B32B 2457/00 (2012.12); H01L 21/6833 (2012.12);
Abstract
A method for repairing an electrostatic chuck device that is formed by bonding an electrostatic chuck member made of ceramics and a temperature-controlling base member made of metal with a first adhesive layer sandwiched therebetween is provided. The method includes a step of repairing the first adhesive layer that has been eroded by using a cold-curing adhesive.