The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2025

Filed:

Feb. 15, 2024
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Kuo-Cheng Ching, Hsinchu County, TW;

Shi-Ning Ju, Hsinchu, TW;

Chih-Hao Wang, Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/088 (2005.12); H01L 21/02 (2005.12); H01L 21/027 (2005.12); H01L 21/033 (2005.12); H01L 21/3105 (2005.12); H01L 21/311 (2005.12); H01L 21/3213 (2005.12); H01L 21/762 (2005.12); H01L 21/8234 (2005.12); H01L 27/02 (2005.12); H01L 29/08 (2005.12); H01L 29/165 (2005.12); H01L 29/205 (2005.12); H01L 29/267 (2005.12); H01L 29/417 (2005.12); H01L 29/66 (2005.12); H01L 29/78 (2005.12);
U.S. Cl.
CPC ...
H01L 27/0886 (2012.12); H01L 21/31111 (2012.12); H01L 21/31116 (2012.12); H01L 21/76224 (2012.12); H01L 21/823418 (2012.12); H01L 21/823431 (2012.12); H01L 21/823437 (2012.12); H01L 21/823481 (2012.12); H01L 27/0207 (2012.12); H01L 29/0847 (2012.12); H01L 29/66545 (2012.12); H01L 29/7848 (2012.12); H01L 21/0217 (2012.12); H01L 21/02271 (2012.12); H01L 21/0228 (2012.12); H01L 21/0274 (2012.12); H01L 21/0332 (2012.12); H01L 21/31053 (2012.12); H01L 21/32139 (2012.12); H01L 29/165 (2012.12); H01L 29/205 (2012.12);
Abstract

A semiconductor device includes first and second semiconductive fins, a first dielectric layer, a first gate structure, a spacer layer, and an oxide material. The first dielectric layer is laterally between the first and second semiconductive fins. From a cross-sectional view taken along a direction perpendicular to a lengthwise direction of the first semiconductive fin, the first dielectric layer has a U-shaped profile. The first gate structure extends across the first and second semiconductive fins and the first dielectric layer. The spacer layer underlies the first dielectric layer and further extends to laterally surround a lower portion of the first dielectric layer, a lower portion of the first semiconductive fin, and a lower portion of the second semiconductive fin. The oxide material is nested in the first dielectric layer. A top surface of the oxide material is at an elevation higher than a top surface of the spacer layer.


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