The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2025
Filed:
Oct. 30, 2023
Amkor Technology Singapore Holding Pte. Ltd, Valley Point, SG;
Tae Ki Kim, Incheon, KR;
Jae Beom Shim, Incheon, KR;
Min Jae Yi, Gyeonggi-do, KR;
Yi Seul Han, Incheon, KR;
Young Ju Lee, Incheon, KR;
Kyeong Tae Kim, Incheon, KR;
Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;
Abstract
An electronic device includes a substrate having a conductive structure with a substrate outward terminal at a second side of the substrate. A dielectric structure with an opening is adjacent to the second side. An electronic component is coupled to the substrate and an encapsulant encapsulates the electronic component. The substrate outward terminal comprises a multi-via terminal or a multi-stage via. The multi-via terminal includes pad conductive vias in the opening, a pad dielectric via interposed between the pad conductive vias, and a conductor comprising a conductor top side with micro dimples over the pad conductive vias and the pad dielectric via. The multi-stage terminal includes a pad base within the opening having a top side recessed below an upper surface the dielectric and a pad head coupled to the pad base within the opening, the pad head having a top side with a micro dimple.