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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12278185 B1

PDFFull Text
Date of Patent:
Apr. 14, 2025

Filed:

Aug. 09, 2023

Power distribution method

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Shih-Wei Peng, Hsinchu, TW;

Te-Hsin Chiu, Hsinchu, TW;

Jiann-Tyng Tzeng, Hsinchu, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;

Attorney:

Hauptman Ham, LLP

Primary Examiner:

Younes Boulghassoul

Assistant Examiner:

Quinton A Brasfield

Int. Cl.
CPC ...
H01L 23/528 (2005.12); H01L 23/00 (2005.12); H01L 23/50 (2005.12); H01L 23/538 (2005.12); H01L 27/06 (2005.12); H10D 88/00 (2024.12);
U.S. Cl.
CPC ...
H01L 23/5286 (2012.12); H01L 23/50 (2012.12); H01L 23/528 (2012.12); H01L 23/5386 (2012.12); H01L 24/94 (2012.12); H10D 88/00 (2024.12);
Abstract

A method of forming an integrated circuit (IC) package includes constructing a first power distribution structure on a first die included in the IC package, thereby electrically connecting the first power distribution structure to a second power distribution structure positioned on a back side of the first die, and bonding a third power distribution structure to the first power distribution structure, the third power distribution structure being positioned on a back side of a second die.

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Peng, Shih-Wei. (2025). Power distribution method (U.S. Patent No. 12278185). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12278185

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