The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2025

Filed:

Jan. 06, 2021
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventor:

Naoki Sugawa, Miyagi, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2005.12); H01J 37/20 (2005.12); H01J 37/305 (2005.12); H01L 21/67 (2005.12);
U.S. Cl.
CPC ...
H01L 21/683 (2012.12); H01J 37/20 (2012.12); H01J 37/305 (2012.12); H01L 21/67069 (2012.12);
Abstract

A stage includes a first mounting part on which a substrate is mounted, a second mounting part on which an edge ring surrounding a peripheral edge of the substrate is mounted, the second mounting part being lower than the first mounting part, a first bonding layer configured to bond a base to the first mounting part, a second bonding layer configured to bond the base to the second mounting part, and a seal member configured to close a space between the first mounting part and the second mounting part by deformation of the seal member above the first bonding layer and the second bonding layer while contacting with each of the first mounting part and the second mounting part.


Find Patent Forward Citations

Quick Actions:

Sugawa, Naoki. (2025). Stage and plasma processing apparatus (U.S. Patent No. 12278131). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12278131

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…