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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12272687 B1

PDFFull Text
Date of Patent:
Apr. 08, 2025

Filed:

Dec. 06, 2022

Semiconductor device package with conductive pillars and reinforcing and encapsulating layers

Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Ya Fang Chan, Kaohsiung, TW;

Yuan-Feng Chiang, Kaohsiung, TW;

Assignee:

ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;

Attorney:

FOLEY & LARDNER LLP

Primary Examiner:

Nicholas J Tobergte

Assistant Examiner:

Adin undefined Hrnjic

Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/762 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 21/486 (2013.01); H01L 21/563 (2013.01); H01L 21/76224 (2013.01); H01L 23/3128 (2013.01); H01L 23/49833 (2013.01); H01L 23/49861 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 2224/02333 (2013.01);
Abstract

A semiconductor device package includes a redistribution layer, a plurality of conductive pillars, a reinforcing layer and an encapsulant. The conductive pillars are in direct contact with the first redistribution layer. The reinforcing layer surrounds a lateral surface of the conductive pillars. The encapsulant encapsulates the first redistribution layer and the reinforcing layer. The conductive pillars are separated from each other by the reinforcing layer.

Find Patent Forward Citations

Chan, Ya. (2025). Semiconductor device package with conductive pillars and reinforcing and encapsulating layers (U.S. Patent No. 12272687). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12272687

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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