The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2025
Filed:
Jan. 02, 2024
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Chiang-Jui Chu, Yilan County, TW;
Ching-Wen Hsiao, Hsinchu, TW;
Hao-Chun Liu, Hsinchu, TW;
Ming-Da Cheng, Taoyuan, TW;
Young-Hwa Wu, Tainan, TW;
Tao-Sheng Chang, Tainan, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); H01L 24/05 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2224/13017 (2013.01); H01L 2224/1355 (2013.01); H01L 2224/16059 (2013.01); H01L 2924/37001 (2013.01);
Abstract
A semiconductor package includes a conductive pillar and a solder. The conductive pillar has a first sidewall and a second sidewall opposite to the first sidewall, wherein a height of the first sidewall is greater than a height of the second sidewall. The solder is disposed on and in direct contact with the conductive pillar, wherein the solder is hanging over the first sidewall and the second sidewall of conductive pillar.