The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2025

Filed:

Apr. 27, 2021
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Ting-Jung Chen, Kaohsiung, TW;

Shih-Wei Lin, Taipei, TW;

Lee-Chuan Tseng, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); C23C 14/50 (2006.01); C23C 14/54 (2006.01); C23C 14/58 (2006.01); C23C 16/458 (2006.01); C23C 16/46 (2006.01); H01J 37/32 (2006.01); H01L 21/67 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01); C23C 14/50 (2013.01); C23C 14/541 (2013.01); C23C 14/5873 (2013.01); C23C 16/4586 (2013.01); C23C 16/466 (2013.01); H01J 37/32724 (2013.01); H01L 21/67109 (2013.01); H01J 2237/002 (2013.01); H01J 2237/2007 (2013.01); H01L 21/67069 (2013.01); H01L 21/76802 (2013.01);
Abstract

In some embodiments, the present disclosure relates to a process tool that includes a chamber housing defined by a processing chamber, and a wafer chuck structure arranged within the processing chamber. The wafer chuck structure is configured to hold a wafer during a fabrication process. The wafer chuck includes a lower portion and an upper portion arranged over the lower portion. The lower portion includes trenches extending from a topmost surface towards a bottommost surface of the lower portion. The upper portion includes openings that are holes, extend completely through the upper portion, and directly overlie the trenches of the lower portion. Multiple of the openings directly overlie each trench. Further, cooling gas piping is coupled to the trenches of the lower portion of the wafer chuck structure, and a cooling gas source is coupled to the cooling gas piping.


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