The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2025
Filed:
Dec. 16, 2021
Ebara Corporation, Tokyo, JP;
Ryuya Koizumi, Tokyo, JP;
EBARA CORPORATION, Tokyo, JP;
Abstract
An optimal number of modules for use is accurately estimated in a semiconductor manufacturing apparatus. Provided is a method applied to a semiconductor manufacturing apparatus including one or a plurality of substrate processing modules each including a plurality of submodules. The present method includes a step of estimating the optimal number of the submodules for use, based on a target production amount and predicted production amount of substrates and a use rate of the substrate processing module, a step of preparing, based on the estimated optimal number for use, a schedule to process a substrate with the optimal number of the submodules for use, a step of updating, based on the prepared schedule, the predicted production amount and the use rate, and a step of repeating the estimating step by use of the updated predicted production amount and use rate, to update the optimal number of the submodules for use.