The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2025

Filed:

May. 14, 2019
Applicant:

Samsung Display Co., Ltd., Yongin-Si, KR;

Inventors:

Seungbae Kang, Suwon-si, KR;

Joon-hwa Bae, Suwon-si, KR;

Heesung Yang, Seoul, KR;

Woojin Cho, Yongin-si, KR;

Byoungkwon Choo, Hwaseong-si, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 7/24 (2006.01); B24B 27/00 (2006.01); B24B 29/02 (2006.01); B24B 37/04 (2012.01); B24B 41/047 (2006.01);
U.S. Cl.
CPC ...
B24B 29/02 (2013.01); B24B 7/242 (2013.01); B24B 27/0076 (2013.01); B24B 41/047 (2013.01); B24B 41/0475 (2013.01);
Abstract

A substrate polishing apparatus including a stage configured to load a substrate, the stage having a flat surface, which is parallel to a first direction and a second direction, and on which the substrate is loaded, a pressing unit configured to exert a pressure on the substrate in a third direction, a rotary unit configured to revolve the pressing unit around a central axis parallel to the third direction, when viewed in a plan view, a plurality of polishing pads provided between the pressing unit and the substrate to be in contact with the substrate, and a nozzle part configured to supply a slurry onto the substrate. The polishing pads may be spaced apart from each other in a direction and may have a rectangular shape in the plan view.


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