The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2025
Filed:
Dec. 21, 2021
Applicant:
Lodestar Licensing Group Llc, Evanston, IL (US);
Inventors:
Koustav Sinha, Boise, ID (US);
Hyunsuk Chun, Boise, ID (US);
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/20 (2006.01); H01L 23/49 (2006.01); H01L 23/498 (2006.01); B23K 101/40 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
B23K 1/20 (2013.01); H01L 23/49816 (2013.01); B23K 2101/40 (2018.08); B23K 2101/42 (2018.08);
Abstract
An apparatus for a BGA package includes a pad mounted on a substrate. The apparatus also includes a solder resist layer disposed over the substrate and a buffer layer disposed over the solder resist layer. The solder resist layer can have a first aperture and the buffer layer can have a second aperture. The first and second apertures are aligned such that at least a portion of the pad is exposed to create a solder-mask-defined mounting pad. A diameter of the second aperture is larger than a diameter of the first aperture.