The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 2025

Filed:

Sep. 24, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Daqiao Du, Lake Oswego, OR (US);

Zhen Zhou, Chandler, AZ (US);

Ismael Franco Núñez, Milwaukie, OR (US);

Gordon P. Melz, Beaverton, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/00 (2006.01); H01R 12/71 (2011.01); H01R 13/05 (2006.01); H01R 13/11 (2006.01); H01R 43/00 (2006.01);
U.S. Cl.
CPC ...
H01R 13/052 (2013.01); H01R 12/712 (2013.01); H01R 13/111 (2013.01); H01R 43/00 (2013.01);
Abstract

An apparatus comprising an interconnect comprising a conductive core; a first conductive layer connected to the conductive core and extending parallel to the conductive core towards a first end of the conductive core; a second conductive layer connected to the conductive core and extending parallel to the conductive core towards a second end of the conductive core; a first non-conductive layer between the conductive core and the first conductive layer; and a second non-conductive layer between the first conductive layer and the second conductive layer.


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