The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2025
Filed:
Jun. 06, 2022
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Kin Pong Lo, Fremont, CA (US);
Vladimir Nagorny, Tracy, CA (US);
Wei Liu, San Jose, CA (US);
Theresa Kramer Guarini, San Jose, CA (US);
Bernard L. Hwang, Santa Clara, CA (US);
Malcolm J. Bevan, Santa Clara, CA (US);
Jacob Abraham, San Jose, CA (US);
Swayambhu Prasad Behera, Santa Clara, CA (US);
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/687 (2006.01); C23C 16/455 (2006.01); C23C 16/458 (2006.01); H01J 37/32 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68735 (2013.01); C23C 16/45536 (2013.01); C23C 16/4585 (2013.01); H01J 37/321 (2013.01); H01J 37/32623 (2013.01); H01J 37/32651 (2013.01); H01L 21/67017 (2013.01);
Abstract
Embodiments of the present disclosure generally relate to the fabrication of integrated circuits and to apparatus for use within a substrate processing chamber to improve film thickness uniformity. More specifically, the embodiments of the disclosure relate to an edge ring. The edge ring may include an overhang ring.