The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 01, 2025

Filed:

Jun. 25, 2020
Applicant:

Showa Denko Materials Co., Ltd., Chiyoda-ku, JP;

Inventors:

Aya Kasahara, Chiyoda-ku, JP;

Tomohiko Kotake, Chiyoda-ku, JP;

Daisuke Fujimoto, Chiyoda-ku, JP;

Assignee:

RESONAC CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/24 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01); C08C 19/22 (2006.01); C08F 222/40 (2006.01); C08F 279/02 (2006.01); C08F 285/00 (2006.01); C08J 5/18 (2006.01); C08L 51/04 (2006.01);
U.S. Cl.
CPC ...
C08J 5/24 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); C08C 19/22 (2013.01); C08F 222/40 (2013.01); C08F 279/02 (2013.01); C08F 285/00 (2013.01); C08J 5/18 (2013.01); C08L 51/04 (2013.01); C08J 2447/00 (2013.01); C08J 2453/02 (2013.01); C08L 2203/20 (2013.01); H05K 2201/0145 (2013.01);
Abstract

The present invention relates to a maleimide resin composition including (A) at least one selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof; and (B) a modified conjugated diene polymer, the component (B) being one resulting from modification of (b1) a conjugated diene polymer having a vinyl group in the side chain with (b2) a maleimide compound having two or more N-substituted maleimide groups and also to a prepreg, a laminate, a resin film, a multilayer printed wiring board, and a semiconductor package, each using the foregoing maleimide resin composition.


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