The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2025
Filed:
Jul. 19, 2023
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Shu-Kwan Danny Lau, Sunnyvale, CA (US);
Toshiyuki Nakagawa, Narita, JP;
Zhiyuan Ye, San Jose, CA (US);
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B23K 26/00 (2014.01); B23K 26/06 (2014.01); B23K 26/08 (2014.01); B23K 103/00 (2006.01); F27B 17/00 (2006.01); F27D 5/00 (2006.01); F27D 9/00 (2006.01); H01L 21/268 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67115 (2013.01); B23K 26/0006 (2013.01); B23K 26/0648 (2013.01); B23K 26/0869 (2013.01); F27B 17/0025 (2013.01); F27D 5/0037 (2013.01); H01L 21/268 (2013.01); H01L 21/68764 (2013.01); B23K 2103/56 (2018.08); F27D 2009/007 (2013.01);
Abstract
Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. In one or more embodiments, a process chamber comprises a first window, a second window, a substrate support disposed between the first window and the second window, and a motorized rotatable radiant spot heating source disposed over the first window and configured to provide radiant energy through the first window.