The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 2025

Filed:

Jul. 22, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Bishnu Prasad Patra, Zoetermeer, NL;

Stefano Pellerano, Beaverton, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); H05K 1/02 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2884 (2013.01); H05K 1/0268 (2013.01); H05K 1/029 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49176 (2013.01); H05K 2201/10053 (2013.01);
Abstract

Technologies for on-circuit board de-embedding are disclosed. In the illustrative embodiment, several micromechanical relays on a circuit board can connect a trace on the circuit board to an open circuit, a closed circuit, a load circuit, or a through circuit. For the through circuit, the trace is connected to an integrated circuit component mounted on the circuit board. A cable is connected to the trace, allowing for signals to be sent to any of the four circuits without any probes connected to the circuit board. The transmitted and/or reflected signals can be measured, which can be used to de-embed the integrated circuit component.


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