The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 2025

Filed:

Nov. 09, 2021
Applicant:

Ebara Corporation, Tokyo, JP;

Inventor:

Masaki Tomita, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 17/06 (2006.01); C25D 21/10 (2006.01);
U.S. Cl.
CPC ...
C25D 17/06 (2013.01); C25D 21/10 (2013.01);
Abstract

Provided is a plating apparatus that allows suppressing a substrate sticking to a back plate assembly. A plating apparatus includes a plating tank configured to house a plating solution, a substrate holder configured to hold a substrate Wf with a surface to be plated Wf-a facing downward, and an elevating mechanism configured to move up and down the substrate holder. The substrate holder includes a supporting mechanismconfigured to support an outer peripheral portion of the surface to be plated Wf-a of the substrate Wf, a back plate assemblyarranged on a back surface side of the surface to be plated Wf-a of the substrate Wf and configured to sandwich the substrate Wf with the supporting mechanism, and a removing mechanismconfigured to provide a force that removes the substrate Wf from the back plate assemblyto a back surface of the surface to be plated Wf-a of the substrate Wf.


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