The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2025
Filed:
Oct. 14, 2020
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventor:
Jinting Jiu, Tokyo, JP;
Assignee:
SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 1/052 (2022.01); B22F 1/00 (2022.01); B22F 1/0545 (2022.01); B22F 1/06 (2022.01); B22F 1/065 (2022.01); B22F 1/068 (2022.01); B22F 1/107 (2022.01); B22F 3/11 (2006.01); B22F 7/00 (2006.01); B22F 7/04 (2006.01); B23K 35/30 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B22F 1/052 (2022.01); B22F 1/00 (2013.01); B22F 1/0545 (2022.01); B22F 1/06 (2022.01); B22F 1/107 (2022.01); B22F 3/11 (2013.01); B22F 7/002 (2013.01); B22F 7/008 (2013.01); B22F 7/04 (2013.01); B23K 35/3006 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); B22F 1/065 (2022.01); B22F 1/068 (2022.01); B22F 2007/042 (2013.01); B22F 2301/10 (2013.01); B22F 2301/15 (2013.01); B22F 2301/255 (2013.01); B22F 2301/30 (2013.01); H01L 2224/271 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29339 (2013.01);
Abstract
In the joined body () in which the conductor () and the substrate () are joined by the joining material (), the joining material () includes a sintered body formed by sintering silver powder. A sintered body having a porosity of 8% to 30% and a surface roughness Ra of a joining surface of 500 nm or more and 3.3 μm or less is adopted.