The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12255148 B1

Date of Patent:

Mar. 18, 2025

Filed:

Feb. 17, 2021

Power distribution structure and method

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Shih-Wei Peng, Hsinchu, TW;

Te-Hsin Chiu, Hsinchu, TW;

Jiann-Tyng Tzeng, Hsinchu, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;

Attorney:

Hauptman Ham, LLP

Primary Examiner:

Younes Boulghassoul

Assistant Examiner:

Quinton A Brasfield

Int. Cl.

CPC ...

H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/50 (2006.01); H01L 23/528 (2006.01); H01L 27/06 (2006.01);

U.S. Cl.

CPC ...

H01L 23/5386 (2013.01); H01L 23/50 (2013.01); H01L 23/5286 (2013.01); H01L 24/94 (2013.01); H01L 27/0688 (2013.01);

Abstract

An IC package includes a first die including a front side and a back side, the front side including a first signal routing structure, the back side including a first power distribution structure, and a second die including a front side and a back side, the front side including a second signal routing structure, the back side including a second power distribution structure. The IC package includes a third power distribution structure positioned between the first and second power distribution structures and electrically connected to each of the first and second power distribution structures.

Find Patent Forward Citations

Peng, Shih-Wei. (2025). Power distribution structure and method (U.S. Patent No. 12255148). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12255148

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile