The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 18, 2025

Filed:

May. 20, 2021
Applicant:

Siltronic Ag, Munich, DE;

Inventors:

Peter Wiesner, Reut, DE;

Wolfgang Gmach, Emmerting, DE;

Robert Kreuzeder, Wurmannsquick, DE;

Assignee:

SILTRONIC AG, Munich, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23D 57/00 (2006.01); B23D 59/00 (2006.01); B28D 5/00 (2006.01); B28D 5/04 (2006.01);
U.S. Cl.
CPC ...
B23D 57/0023 (2013.01); B23D 57/0061 (2013.01); B23D 59/002 (2013.01); B28D 5/0064 (2013.01); B28D 5/0076 (2013.01); B28D 5/045 (2013.01);
Abstract

Slices are cut from workpieces using a wire saw having a wire array tensioned in a plane between two wire guide rollers each supported between fixed and floating bearings and comprising a chamber and a shell enclosing a core and having guide grooves for wires. During a cut-off operation, a workpiece is fed through the wire array perpendicular to a workpiece axis and the wire array plane. The workpiece is fed through the wire array while simultaneously: changing shell lengths by adjusting chamber temperatures in dependence on a depth of cut and a first correction profile; and moving the workpiece along the workpiece axis in accordance with a second correction profile. The correction profiles are opposed to a shape deviation.


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