The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 11, 2025

Filed:

Aug. 26, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Jun-Yao Chen, Taoyuan, TW;

Hung Cho Wang, Taipei, TW;

Harry-Hak-Lay Chuang, Zhubei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10N 50/80 (2023.01); H10B 61/00 (2023.01); H10N 50/01 (2023.01); H10N 50/10 (2023.01);
U.S. Cl.
CPC ...
H10N 50/80 (2023.02); H10B 61/10 (2023.02); H10B 61/20 (2023.02); H10B 61/22 (2023.02); H10N 50/01 (2023.02); H10N 50/10 (2023.02);
Abstract

The present disclosure relate to semiconductor structure that includes a substrate and a memory array. The memory array is spaced over the substrate and has a plurality of rows and a plurality of columns. Further, the memory array comprises a first memory cell and a second memory cell that are adjacent at a common elevation above the substrate. The second memory cell is at an edge of the memory array and separates the first memory cell from the edge, and a top surface of the first memory cell is recessed relative to a top surface of the second memory cell.


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