The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 11, 2025

Filed:

Jul. 06, 2022
Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventors:

Toshiaki Aoki, Nagano, JP;

Toyoaki Sakai, Nagano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/186 (2013.01); H05K 1/115 (2013.01); H05K 3/0094 (2013.01); H05K 3/422 (2013.01); H05K 2201/0212 (2013.01); H05K 2201/086 (2013.01); H05K 2201/0959 (2013.01); H05K 2201/1003 (2013.01); H05K 2203/072 (2013.01);
Abstract

A wiring board includes a base material, a through hole that is formed in the base material, a magnetic member that is embedded in the through hole, and a plating film that covers end faces of the magnetic member exposed from the through hole. The magnetic member includes a conductor wire that is covered by a magnetic body. A wiring board manufacturing method includes forming a through hole in a base material, forming a magnetic member by covering a conductor wire by a magnetic body, embedding the magnetic member in the through hole, and forming a plating film that covers end faces of the magnetic member exposed from the through hole.


Find Patent Forward Citations

Loading…