The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2025
Filed:
Dec. 22, 2021
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/64 (2006.01); H01R 12/72 (2011.01); H01R 12/73 (2011.01); H01R 13/03 (2006.01); H01R 13/04 (2006.01); H01R 13/10 (2006.01);
U.S. Cl.
CPC ...
H01R 13/64 (2013.01); H01R 12/727 (2013.01); H01R 13/03 (2013.01); H01R 13/04 (2013.01); H01R 13/10 (2013.01); H01R 12/732 (2013.01); H01R 2201/04 (2013.01); H01R 2201/06 (2013.01); H01R 2201/24 (2013.01);
Abstract
Disclosed embodiments include a modified M.2 interface that is configured to allow an increased current capacity on power-carrying pins. The power-carrying pins are implemented using an alloy that can sustain current levels in excess of those specified in the M.2 standard while remaining within M.2 standard specified temperature limits. Sockets and corresponding cards in embodiments are modified so that a card requiring the higher current capacity cannot fit into a legacy M.2 standard socket, while a legacy M.2 card can fit into a modified high current M.2 socket. Other embodiments may be described and/or claimed.