The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2025
Filed:
May. 03, 2022
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Chia-Cheng Ho, Hsinchu, TW;
Hui-Ting Lu, Zhudong Township, TW;
Pei-Lun Wang, Zhubei, TW;
Yu-Chang Jong, Hsinchu, TW;
Jyun-Guan Jhou, Taoyuan, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
Various embodiments of the present disclosure are directed towards an integrated chip comprising a gate electrode disposed on a substrate between a pair of source/drain regions. A dielectric layer is over the substrate. A field plate is disposed on the dielectric layer and laterally between the gate electrode and a first source/drain region in the pair of source/drain regions. The field plate comprises a first field plate layer and a second field plate layer. The second field plate layer extends along sidewalls and a bottom surface of the first field plate layer. The first and second field plate layers comprise a conductive material.