The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2025
Filed:
Sep. 20, 2021
Applicant:
Commissariat À L'energie Atomique ET Aux Énergies Alternatives, Paris, FR;
Inventors:
Candice Thomas, Grenoble, FR;
Jean Charbonnier, Grenoble, FR;
Perceval Coudrain, Grenoble, FR;
Maud Vinet, Grenoble, FR;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49888 (2013.01); H01L 21/486 (2013.01); H01L 23/49838 (2013.01); H01L 23/5386 (2013.01); H01L 24/02 (2013.01); H01L 24/06 (2013.01); H01L 24/08 (2013.01); H01L 24/14 (2013.01); H01L 24/80 (2013.01); H01L 24/81 (2013.01); H01L 23/481 (2013.01); H01L 23/49827 (2013.01); H01L 24/05 (2013.01); H01L 24/16 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/02375 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/06505 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/14505 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/80031 (2013.01); H01L 2224/80051 (2013.01); H01L 2224/80203 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/81193 (2013.01);
Abstract
An integrated structure intended to connect a plurality of semiconductor devices, the integrated structure including a substrate, a first face and a second face, the first face being intended to receive the semiconductor devices, the integrated structure including, at the first face, at least one routing level, the routing level or levels including: at least one first conductor routing track in a conductor material; and at least one first superconductor routing track made from a superconductor material.