The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 11, 2025

Filed:

Jan. 05, 2022
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventor:

Hsiang-Wei Lin, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/482 (2006.01); H01L 21/762 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4821 (2013.01); H01L 21/76289 (2013.01); H01L 23/4828 (2013.01);
Abstract

A device includes a first conductive feature in an insulating layer; a dielectric layer over the first conductive feature; a second conductive feature in the dielectric layer, wherein the second conductive feature is over and physically contacting the first conductive feature; an air spacer encircling the second conductive feature, wherein sidewalls of the second conductive feature are exposed to the air spacer; a metal cap covering the second conductive feature and extending over the air spacer, wherein the air spacer is sealed by a bottom surface of the metal cap; a first etch stop layer on the dielectric layer, wherein a sidewall of the first etch stop layer physically contacts a sidewall of the metal cap; and a second etch stop layer extending on a top surface of the metal cap and a top surface of the first etch stop layer.


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