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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12249520 B1

PDFFull Text
Date of Patent:
Mar. 11, 2025

Filed:

Aug. 28, 2021

Wet etch apparatus

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Hong-Ting Lu, Taichung, TW;

Han-Wen Liao, Taichung, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;

Attorney:

Maschoff Brennan

Primary Examiner:

Wojciech Haske

Int. Cl.
CPC ...
H01L 21/67 (2006.01); C25F 3/02 (2006.01); C25F 3/12 (2006.01); H01L 21/306 (2006.01); H01L 21/3063 (2006.01); H01L 21/3213 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6708 (2013.01); C25F 3/02 (2013.01); C25F 3/12 (2013.01); H01L 21/306 (2013.01); H01L 21/30604 (2013.01); H01L 21/30608 (2013.01); H01L 21/3063 (2013.01); H01L 21/32133 (2013.01); H01L 21/32134 (2013.01); H01L 21/6831 (2013.01); H01L 21/687 (2013.01); H01L 29/66545 (2013.01);
Abstract

A wet etch apparatus includes a wafer chuck, a dispensing nozzle, a liquid etchant container, and an electric field generator. The dispensing nozzle is above the wafer chuck. The liquid etchant container is in fluid communication with the dispensing nozzle. The electric field generator is operative to generate an electric field across the wafer chuck. The electric field generator includes a first electrode and a second electrode spaced apart from the first electrode in a direction substantially perpendicular to a top surface of the wafer chuck, and the second electrode is an electrode plate above the wafer chuck.

Find Patent Forward Citations

Lu, Hong-Ting. (2025). Wet etch apparatus (U.S. Patent No. 12249520). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12249520

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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