The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2025
Filed:
Sep. 21, 2018
Cj Cheiljedang Corporation, Seoul, KR;
Byung Kook Lee, Seoul, KR;
Kwang Soo Park, Gwacheon-si, KR;
Hui Jae Song, Seoul, KR;
Gyu Hwan Cha, Seoul, KR;
CJ CHEILJEDANG CORPORATION, Seoul, KR;
Abstract
The present invention provides a receptacle molding apparatus, a receptacle and a receptacle molding method. The receptacle molding apparatus, which is for molding a receptacle by means of heat molding, comprises: a first mold portion comprising a body molding part, which is for molding a body of a receptacle, a skirt molding part, which extends upward from the body molding part so as to mold a skirt of the receptacle, and a flange molding part which extends in the direction from the upper end of the skirt molding part toward the outside so as to mold the lower surface of a flange of the receptacle; and a second mold portion which is provided above the first mold portion, can move vertically and enable pressure-molding of the upper surface of the flange, and has a pressing surface for pressing a sheet which is to be molded into the flange from above at a position corresponding to the flange molding part. The pressing surface comprises an extension part which is a part extending further than the inner end part of the flange molding part in the direction toward the center of the body molding part.