The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 11, 2025

Filed:

Nov. 22, 2023
Applicant:

Taiwan Semiconductor Manufacturing Company Limited, Hsin-Chu, TW;

Inventors:

Vincent Chien, New Taipei, TW;

Shih Yi-Cheng, Zhubei, TW;

Hill Liao, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B08B 5/04 (2006.01); B08B 13/00 (2006.01); B23P 6/00 (2006.01); H01L 21/677 (2006.01); B08B 3/02 (2006.01); B08B 5/02 (2006.01);
U.S. Cl.
CPC ...
B23P 6/00 (2013.01); B08B 5/043 (2013.01); B08B 13/00 (2013.01); H01L 21/67155 (2013.01); H01L 21/67703 (2013.01); H01L 21/67724 (2013.01); H01L 21/67745 (2013.01); B08B 3/02 (2013.01); B08B 5/02 (2013.01); B08B 5/04 (2013.01);
Abstract

A system for maintaining a device in a semiconductor manufacturing environment that includes a controller configured to determine a distance travelled by the device within the semiconductor manufacturing environment, where the device has a feature that selectively engages a carrier configured to carry a semiconductor wafer such that the device moves the semiconductor wafer to different processing stations within the semiconductor manufacturing environment. The system also includes an inspection component configured to inspect the device responsive to the distance travelled by the device exceeding a distance threshold, a repair component configured to repair the device responsive to a repair indication from at least one of the controller or the inspection component, and a cleaning component configured to clean the device responsive to a clean indication from at least one of the controller or the inspection component.


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