The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2025
Filed:
Apr. 29, 2021
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
Chih Lung Lin, Kaohsiung, TW;
Kuei-Hao Tseng, Kaohsiung, TW;
Te Kao Tsui, Kaohsiung, TW;
Kai Hung Wang, Kaohsiung, TW;
Hung-I Lin, Kaohsiung, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61B 5/00 (2006.01); H05K 1/02 (2006.01); A61B 5/024 (2006.01); A61B 5/0531 (2021.01); A61B 5/145 (2006.01); A61B 5/318 (2021.01); A61B 5/369 (2021.01); A61B 5/389 (2021.01); A61B 5/398 (2021.01);
U.S. Cl.
CPC ...
A61B 5/6817 (2013.01); A61B 5/0002 (2013.01); H05K 1/0277 (2013.01); A61B 5/024 (2013.01); A61B 5/02405 (2013.01); A61B 5/0531 (2013.01); A61B 5/14517 (2013.01); A61B 5/14539 (2013.01); A61B 5/318 (2021.01); A61B 5/369 (2021.01); A61B 5/389 (2021.01); A61B 5/398 (2021.01); A61B 2562/0204 (2013.01); A61B 2562/0209 (2013.01); A61B 2562/0219 (2013.01); A61B 2562/0238 (2013.01); A61B 2562/0247 (2013.01); A61B 2562/0271 (2013.01); A61B 2562/029 (2013.01); A61B 2562/12 (2013.01); A61B 2562/164 (2013.01); H05K 2201/10151 (2013.01);
Abstract
The present disclosure provides an electronic device. The electronic device includes a flexible element, and a sensing element adjacent to the flexible element and configured to detect a biosignal. The electronic device also includes an active component in the flexible element and electrically connected with the sensing element. A method of manufacturing an electronic device is also disclosed.