The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2025
Filed:
Apr. 20, 2022
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A method includes forming an integrated circuit and a testing pattern over a die region of a wafer and a scribe line region of the wafer, respectively, in which the integrated circuit and the testing pattern are formed by a same fabrication process; connecting a via of a testing chip to a testing pad of the testing pattern; performing a testing process to the die region by detecting electrical properties of the testing pattern through the testing chip; after the testing process is completed, forming an interconnection structure over the integrated circuit, in which the interconnection structure includes conductive features electrically connected to the integrated circuit; and after the interconnection structure is formed over the integrated circuit performing an singulation process through the scribe line region of the wafer, such that the die region of the wafer is singulated into an individual die.