The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2025
Filed:
Sep. 07, 2021
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
William J. Gallagher, Ardsley, NY (US);
Eugene J. O'Sullivan, Nyack, NY (US);
Naigang Wang, Ossining, NY (US);
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); B81B 3/00 (2006.01); H10N 50/01 (2023.01); H10N 50/85 (2023.01); H10N 52/01 (2023.01); H01F 41/04 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00373 (2013.01); B81B 3/0021 (2013.01); B81C 1/00142 (2013.01); B81C 1/00706 (2013.01); H10N 50/01 (2023.02); H10N 50/85 (2023.02); H10N 52/01 (2023.02); B81B 2201/038 (2013.01); B81B 2203/0118 (2013.01); B81C 2201/0188 (2013.01); H01F 41/046 (2013.01); H01L 28/10 (2013.01);
Abstract
A micro-electromechanical device and method of manufacture are disclosed. A sacrificial layer is formed on a silicon substrate. A metal layer is formed on a top surface of the sacrificial layer. Soft magnetic material is electrolessly deposited on the metal layer to manufacture the micro-electromechanical device. The sacrificial layer is removed to produce a metal beam separated from the silicon substrate by a space.