The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2025

Filed:

Jan. 16, 2024
Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Shun-Li Chen, Tainan, TW;

Chung-Te Lin, Tainan, TW;

Hui-Zhong Zhuang, Kaohsiung, TW;

Pin-Dai Sue, Tainan, TW;

Jung-Chan Yang, Taoyuan, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 21/285 (2006.01); H01L 21/8238 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01); H01L 27/02 (2006.01); H01L 27/092 (2006.01); H01L 29/417 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0207 (2013.01); H01L 21/28525 (2013.01); H01L 21/28568 (2013.01); H01L 21/823821 (2013.01); H01L 21/823871 (2013.01); H01L 23/522 (2013.01); H01L 23/5286 (2013.01); H01L 23/53209 (2013.01); H01L 23/53271 (2013.01); H01L 27/0924 (2013.01); H01L 29/41791 (2013.01); H01L 29/42356 (2013.01); H01L 29/42372 (2013.01); H01L 29/42376 (2013.01); H01L 29/4238 (2013.01); H01L 29/66795 (2013.01); H01L 29/7855 (2013.01); H01L 29/7856 (2013.01);
Abstract

A semiconductor device includes a fin structure, a first conductive line, a second conductive line and a first conductive rail. The fin structure is disposed on a substrate. The first conductive line is arranged to wrap a first portion of the fin structure. The second conductive line is attached on a second portion of the fin structure. The second portion is different from the first portion. The first conductive rail is disposed in a same layer as the first conductive line and the second conductive line on the substrate. The first conductive rail is attached on one end of the first conductive line and one end of the second conductive line for electrically connecting the first conductive line and the second conductive line.


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